A specialized climatic chamber designed to conduct temperature stress tests during the Environmental Stress Screening (ESS) process. Its compact bench-top form factor makes it ideal for laboratory and R&D environments where space is limited but precision and repeatability are essential. It identifies defects in products early, helping to ensure reliability, quality and long-term field performance.
Advanced thermal stress screening capabilities in a small, laboratory-friendly bench-top format.
Conducts controlled temperature stress tests during the ESS process to expose latent manufacturing defects early in the product lifecycle — improving reliability before field deployment.
Rapid heating and cooling transitions accelerate thermal cycling tests, reducing overall test duration while maintaining precise and repeatable conditions.
Small footprint optimized for laboratory benches and R&D test cells where floor-standing chambers are impractical — without compromising thermal performance.
Advanced digital controller with programmable temperature profiles ensures accurate set-point tracking, uniform chamber conditions, and repeatable test cycles.
Optional humidity control extends the chamber into combined temperature-humidity testing — useful for moisture-sensitive components and material validation.
Built-in over-temperature protection, compressor safeguards and self-diagnostics keep the chamber and the device under test safe throughout every test cycle.
Reliable ESS screening for compact components, PCBAs, sensors and small assemblies.
Screening of printed circuit board assemblies, semiconductor devices, sensors and small electronic modules against thermal stress.
Thermal validation of small avionics, connectors, and flight-critical sub-assemblies during design and production screening.
Temperature cycling for ECUs, sensors, and small automotive electronic subsystems to meet automotive-grade reliability standards.
Compact form factor makes it ideal for research labs, universities and pilot production lines running frequent short test cycles.
Precision thermal cycling for components, PCBAs and small assemblies — engineered for repeatable ESS screening.
Typical low-temperature cycling down to −70 °C with high-temperature stress screening up to +180 °C (model dependent).
Fast heating and cooling transitions to shorten thermal cycling tests and increase throughput in the screening line.
Compact internal volume optimized for components, PCBAs, sensors and small test assemblies within a bench-top footprint.
Programmable digital controller with multi-step profiles, data logging and repeatable cycle execution for ESS workflows.
Tell us your device size, required temperature range, ramp rate and test standard. Our team can help identify or customize a bench-top climatic chamber configuration for your ESS and reliability testing application.
